韩媒：英伟达疑煽动三星、SK海力士竞争，以压低HBM价格_老虎社区_美港股上老虎

韩媒：英伟达疑煽动三星、SK海力士竞争，以压低HBM价格

华尔街见闻05-04

4月25日，SK集团董事长崔泰源（Chey Tae-won）匆匆前往硅谷与英伟达CEO黄仁勋（Jensen Huang）会面，被认为似乎跟这些策略有关。据韩国媒体BusinessKorea近日报道，在人工智能芯片对于高带宽内存HBM需求的推动下，自2023年以来，第三代的HBM3的报价已经上涨超过5倍。这对于英伟达等AI芯片大厂来说，所需的关键HBM价格大涨，势必会影响其AI芯片的成本。在此背景下...

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Huang）会面，似乎跟这些策略有关。虽然过去一个多月来，英伟达一直在测试三星领先业界开发出的12层堆叠的HBM3E，却迟未下单采购。市场解读，这是一种策略，目标是激励三星与SK海力士进行价格竞争。在最新的一季度财报会议上，三星表示，将继续增加HBM供应，以满足对生成人工智能不断增长的需求。本月，三星已经开始量产8层堆叠的HBM3E ，并计划在第二季度量产12层堆叠的HBM3E产品。SK海力士社长郭鲁正（Kwak Noh-Jung）也在一季度财报会议上表示，2025年的AI芯片组用的HBM几乎全数售罄，2024年的供应也已全部订光。他说，12层堆叠的HBM3E将在今年5月送样，预计第三季开始量产。SK海力士正在与一些客户就HBM的长期合同进行谈判。","kind":null,"is_publish_news":null,"is_publish_highlight":null,"is_publish_live":null,"is_publish_wemedia":null,"editions":null,"symbols":[],"gpt_button":0},"commentList":[],"hasMoreComments":false,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false}}